Thank you for providing me with the satisfied products and very thoughtful service! We will order again!
—— Roy Hilliard
The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!
—— David Balazic
We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.
Tungsten Copper Heat Sink For Hermetic Packages Electronics In Microelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal ... Read More
Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also ... Read More
CPC Heat Sink / Carrier / Submount / Flange For RF And Microwave Amplifier / Transistor / TR Moudle Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and ... Read More
Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion ... Read More
Hermetic Packages Electronics Material S-CMC Carrier / Flange / Heat Spreader Description: S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high ... Read More
Hermetic Packages Electronics Material Cu/MoCu/Cu High-Performance Heat Sink Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ... Read More
Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion ... Read More
CPC141 Carrier / Heat Spreader / Flange For Hermetic Packages And Microelectronic Packages Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two ... Read More
MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE Description: Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and ... Read More
Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange Description: Cu/Mo/Cu(CMC) carrier, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure ... Read More