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|Plating:||Gold||Application:||High Power Device|
Low CTE Copper Tungsten Electronic Packaging Materials WCu Heat Sink
CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and tungsten (a.k.a. wolfram).
Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
High thermal conductivity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products available
|Thermal conductivity at 25ºC||Coefficient of thermal expansion at 20ºC|
Applies to high-power device package of materials, such as substrates; high-performance lead frame; military and civilian thermal control devices such as thermal control panels and radiators.