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Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

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Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

China Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink supplier
Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink supplier Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink supplier Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink supplier

Large Image :  Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Certification: ISO9001
Model Number: 50WCu,75WCu,80WCu,85WCu,90WCu

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: as customer required
Delivery Time: 15days
Payment Terms: L/C, , T/T, Western Union
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Detailed Product Description
Material: Tungsten Copper Density: 16.4
CTE: 7.2 TC: 180-190
Plating: Gold Application: High Power Device
High Light:

tungsten copper heat spreader

,

copper molybdenum heat base

 

Low CTE Copper Tungsten Electronic Packaging Materials WCu Heat Sink
 
Description:

CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and tungsten (a.k.a. wolfram).

Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

 
Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products available


Product Properties:

 

Grade Wt%(W) Wt%(Cu) Density
at 20ºC
Thermal conductivity at 25ºC Coefficient of thermal expansion at 20ºC
W90Cu10 90±1 rest 17.0g/cm3 180-190 6.5
W85Cu15 85±1 rest 16.4g/cm3 190-200 7.0
W80Cu20 80±1 rest 15.6g/cm3 200-210 8.3
W75Cu25 75±1 rest 14.9g/cm3 220-230 9.0
W50Cu50 50±1 rest 12.2g/cm3 310-340 12.5


 
Application:

Applies to high-power device package of materials, such as substrates; high-performance lead frame; military and civilian thermal control devices such as thermal control panels and radiators.


Product picture:
 

Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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