Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink
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Large Image :
Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink
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Product Details:
| Place of Origin: |
CHINA |
| Brand Name: |
JBNR |
| Model Number: |
CPC141,CPC232,CPC300 |
Payment & Shipping Terms:
| Minimum Order Quantity: |
Negotiation |
| Price: |
Negotiable |
| Packaging Details: |
as customer required |
| Delivery Time: |
15days |
| Payment Terms: |
L/C, , T/T, Western Union |
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Detailed Product Description
| Material: |
Copper/moly Copper/copper |
Density: |
9.5 |
| CTE: |
7.3 |
TC: |
170 |
| High Light: |
tungsten copper heat spreader, copper molybdenum heat base |
Hermetic Packages Electronics Material Cu/MoCu/Cu High-Performance Heat Sink
Description:
Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.
Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism
Product Properties:
| Grade |
Density g/cm3 |
Coefficient of thermal
Expansion ×10-6 (20℃)
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Coefficient of thermal
Expansion ×10-6 (20℃)
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| CPC141 |
9.5 |
7.3 |
280(XY)/170(Z)
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| CPC232 |
9.3 |
10.2 |
255(XY)/250(Z) |
Application:
It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
Product picture:
