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|Plating:||Nickel And Gold||Name:||Electronic Packaging Materials|
Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication
Mo-Cu composite is similar with Tungsten-copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-cu.
1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
|Grade||Mo Content||Density g/cm3||
Coefficient of thermal
Expansion ×10-6 (20℃)
|Thermal conductivity W/(M·K)|
These composite are widely used in applications, such as optoelectronics packages Microwave Packages, C Packages, Laser Sub-mounts, etc