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S-CMC Carrier / Flange Hermetic Packages Electronics Material Good Processability

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Tungsten Copper Base Circuit Board

Polished CMC Block Heat Sink

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Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

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The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

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S-CMC Carrier / Flange Hermetic Packages Electronics Material Good Processability

: Large Image : S-CMC Carrier / Flange Hermetic Packages Electronics Material Good Processability

Product Details:

Place of Origin:	CHINA
Brand Name:	JBNR
Model Number:	S-CMC13.3

Payment & Shipping Terms:

Minimum Order Quantity:	Negotiation
Price:	Negotiable
Packaging Details:	as customer required
Delivery Time:	15days
Payment Terms:	L/C, , T/T, Western Union

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Detailed Product Description

Material:	Copper/moly/copper/moly/copper	Density:	9.1
CTE:	10.9	TC:	320
High Light:	molybdenum copper heat spreaders , copper molybdenum heat base

Material:

Copper/moly/copper/moly/copper

Density:

9.1

CTE:

10.9

TC:

320

High Light:

molybdenum copper heat spreaders

copper molybdenum heat base

Hermetic Packages Electronics Material S-CMC Carrier / Flange / Heat Spreader

Description:

S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.

Advantages:

1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity

Product Properties:

Material	Wt% Molybdenum Content	g/cm³ Density	Thermal conductivity at25℃	Coefficient of thermal expansion at 25℃
S-CMC	5	9.0	362	14.8
	10	9.0	335	11.8
	13.3	9.1	320	10.9
	20	9.2	291	7.4

Application:

S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.

Product picture:

S-CMC Carrier / Flange Hermetic Packages Electronics Material Good Processability

Tag:

molybdenum copper heat spreaders,

copper molybdenum heat base

Contact Details

Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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