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Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink

China Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink supplier
Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink supplier Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink supplier Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink supplier

Large Image :  Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Model Number: CMC111,CMC121,CMC131,CMC141,CMC13/74/13

Payment & Shipping Terms:

Packaging Details: as customer required
Delivery Time: 15days
Payment Terms: L/C, , T/T, Western Union
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Detailed Product Description
Material: Copper/moly/copper Density: 9.75
CTE: 6 TC: 180-200
Plating: Nickel And Gold Application: Microwave Carriers

Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials
 
Description:

 

Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high TC.All types of Cu/Mo/Cu sheets can be stamped into components.
 
Advantages:
 
1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity
 
Product Properties:

 

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CMC111 9.32 8.8 305(XY)/250(Z)
CMC121 9.54 7.8 260(XY)/210(Z)
CMC131 9.66 6.8 244(XY)/190(Z)
CMC141 9.75 6 220(XY)/180(Z)
CMC13/74/13 9.88 5.6 200(XY)/170(Z)

 

Application:

Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages.GaAs device mount.

 

Product picture:

 

Longlife Hermetic Packages Electronics Cu - Mo - Cu CMC Sandwich Heat Sink

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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