Product Details:
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Material: | Copper/moly/copper | Density: | 9.75 |
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CTE: | 6 | TC: | 180-200 |
Plating: | Nickel And Gold | Application: | Microwave Carriers |
High Light: | tungsten copper heat spreader,copper molybdenum heat base |
Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials
Description:
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
CMC111 | 9.32 | 8.8 | 305(XY)/250(Z) |
CMC121 | 9.54 | 7.8 | 260(XY)/210(Z) |
CMC131 | 9.66 | 6.8 | 244(XY)/190(Z) |
CMC141 | 9.75 | 6 | 220(XY)/180(Z) |
CMC13/74/13 | 9.88 | 5.6 | 200(XY)/170(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages.GaAs device mount.
Product picture: