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| Material: | Molybdenum Copper | Density: | 9.66 |
|---|---|---|---|
| CTE: | 7.5 | TC: | 220 |
| High Light: | molybdenum copper heat spreaders,copper molybdenum heat base |
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MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE
Description:
Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Advantages:
1. This molybdenum copper flange feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flange is much lighter than comparable tungsten copper composite,so it is more suitable for aerospace and other field.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Product picture:
