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|Plating:||Silver||Name:||Electronic Packaging Materials|
tungsten copper heat spreader,
copper molybdenum heat base
High-tech MoCu Electronic Packaging Materials With Silver Plating
The MoCu composite exhibits combinational properties such as high electrical and thermal conductivities, low CTE, nonmagnetic, good high-temperature performance and etc. Compared with traditional packaging materials, they have a high thermal conductivity and their CTEs can be tailored by adjusting the Mo/Cu ratio to closely match those of die materials.
Compared with WCu materials which also enjoy high thermal conductivity and are CTE changeable, MoCu materials have a lower density.
1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
|Grade||Mo Content||Density g/cm3||
Coefficient of thermal
Expansion ×10-6 (20℃)
|Thermal conductivity W/(M·K)|
Molybdenum copper composites to be used extensively in microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.