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| Material: | Molybdenum Copper | Density: | 9.9 |
|---|---|---|---|
| CTE: | 7 | TC: | 170-190 |
| Plating: | Silver | Name: | Electronic Packaging Materials |
| High Light: | tungsten copper heat spreader,copper molybdenum heat base |
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High-tech MoCu Electronic Packaging Materials With Silver Plating
Description:
The MoCu composite exhibits combinational properties such as high electrical and thermal conductivities, low CTE, nonmagnetic, good high-temperature performance and etc. Compared with traditional packaging materials, they have a high thermal conductivity and their CTEs can be tailored by adjusting the Mo/Cu ratio to closely match those of die materials.
Compared with WCu materials which also enjoy high thermal conductivity and are CTE changeable, MoCu materials have a lower density.
Advantages:
1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper composites to be used extensively in microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
Product picture:
