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CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

China CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier supplier
CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier supplier CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier supplier

Large Image :  CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Model Number: CPC141,CPC232,CPC300

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: as customer required
Delivery Time: 15days
Payment Terms: L/C, , T/T, Western Union
Detailed Product Description
Material: Copper/moly Copper/copper Density: 9.5
CTE: 7.3 TC: 170
High Light:

molybdenum copper heat spreaders

,

copper molybdenum heat base

CPC Heat Sink / Carrier / Submount / Flange For RF And Microwave Amplifier / Transistor / TR Moudle
 
 
Description:

 

CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.
 
Advantages:
 
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism
 
Product Properties:
 
Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)

CPC141 9.5 7.3

280(XY)/170(Z)

CPC232 9.3 10.2              255(XY)/250(Z)

 

Application:


It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc. 
 

Product picture:
 

CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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