Product Details:
Payment & Shipping Terms:
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Material: | Copper/moly Copper/copper | Density: | 9.5 |
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CTE: | 7.3 | TC: | 170 |
High Light: | molybdenum copper heat spreaders,copper molybdenum heat base |
CPC Heat Sink / Carrier / Submount / Flange For RF And Microwave Amplifier / Transistor / TR Moudle
Description:
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 |
280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
Product picture: