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Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink
Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.
Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Good thermal conductivity
Good mechanical strength to provide excellent mechanical protection to the IC
Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.