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Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

China Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics supplier

Large Image :  Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

Product Details:

Place of Origin: china
Brand Name: JBNR
Certification: ISO9001
Model Number: HCWC001

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: Wooden packages
Payment Terms: D/P, , L/C, T/T, Western Union
Supply Ability: 5ton per month
Detailed Product Description
Material: W90Cu10 , W85Cu15 , W80CU20 Surface: Blank Be Polished
Plating: Nickel Or Gold Plating Offer: Plate, Cube , Sheet , Fabricated Parts
High Light:

tungsten copper heat spreader

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copper molybdenum heat base

Tungsten Copper Heat Sink For Hermetic Packages Electronics In Microelectronics

 

Description:

Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.

Tungsten copper heat sink is a composite of tungsten and copper, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be adjusted to meet different requirements.

The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.

 

Advantages:

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low porosity

 

Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

 

Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: admin

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