Product Details:
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| Material: | Tungsten Copper | Density: | 12.2 |
|---|---|---|---|
| CTE: | 12.5 | TC: | 310 |
| High Light: | tungsten copper heat spreader,copper molybdenum heat base |
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Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount
Description:
(1) Ceramic materials: Al2O3(A-90,A-95,A-99),BeO(B-95, B-99),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs etc.;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.
Product picture:
