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Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

China Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange supplier

Large Image :  Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Model Number: CMC111,CMC121,CMC131,CMC141,CMC13/74/13

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: as customer required
Delivery Time: 15days
Payment Terms: L/C, , T/T, Western Union
Detailed Product Description
Material: Copper/moly/copper Density: 9.66
CTE: 6.8 TC: 190
High Light:

molybdenum copper heat spreaders

,

tungsten copper heat spreader

Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange

 
Description:

 

Cu/Mo/Cu(CMC) carrier, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.


 
Advantages:
 
1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity
 
Product Properties:

 

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CMC111 9.32 8.8 305(XY)/250(Z)
CMC121 9.54 7.8 260(XY)/210(Z)
CMC131 9.66 6.8 244(XY)/190(Z)
CMC141 9.75 6.0 220(XY)/180(Z)
CMC13/74/13 9.88 5.6 200(XY)/170(Z)

 

 

Application:
 

Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

 

Product picture:

Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange


 
 

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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