Product Details:
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| Material: | Molybdenum Copper | Density: | 10 |
|---|---|---|---|
| CTE: | 6.8 | TC: | 160-180 |
| Plating: | Nickel And Gold | Application: | RF And Microwave Amplifiers |
| High Light: | tungsten copper heat spreader,copper molybdenum heat base |
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MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate
Description:
Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
Advantages:
High thermal conductivity since no sintering additives have been used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content no more than 75 wt%)
Semi-finished or finished (Ni/Au plated) parts available
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Product picture:
