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|Plating:||Nickel And Gold||Application:||RF And Microwave Amplifiers|
MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate
Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
High thermal conductivity since no sintering additives have been used
Relatively small density
Stampable sheets available (Mo content no more than 75 wt%)
Semi-finished or finished (Ni/Au plated) parts available
|Grade||Mo Content||Density g/cm3||
Coefficient of thermal
Expansion ×10-6 (20℃)
|Thermal conductivity W/(M·K)|
These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.