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Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

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Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

China Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials supplier
Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials supplier Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials supplier

Large Image :  Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Model Number: 50WCu,60WCu,70WCu,85WCu

Payment & Shipping Terms:

Minimum Order Quantity: Negotiation
Price: Negotiable
Packaging Details: as customer required
Delivery Time: 25days
Payment Terms: L/C, , T/T, Western Union
Supply Ability: 1000000pcs per month
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Detailed Product Description
Material: Tungsten Copper Density: 16.4
CTE: 7.2 TC: 180-190
Brand: JBNR Application: Electronic Packaging

 

Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials
 
Description:

Copper Tungsten are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

 
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
5. Low void
 
Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

 

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)
         
         

Application:
 
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.
 
Product picture:
 

Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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