Thank you for providing me with the satisfied products and very thoughtful service! We will order again!
—— Roy Hilliard
The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!
—— David Balazic
We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.
High Thermal Expansion Molybdenum Copper Flanges For RF and Microwave Packages In Microelectronics Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ... Read More
Nickel Plated Gold Plated Good Lamination Cu/Mo70Cu/Cu Carriers In High Power Devices Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad ... Read More
Excellent CTE Light Weight Molybdenum Copper Spacer For IGBT Devices Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and ... Read More
Light Weight And Tailored Thermal Conductivity Molybdenum Copper Heat Transfer For Sensitive Electronic Components Description: With technology development, there are more need for higher power in smaller ... Read More
Molybdenum Copper Heat Sink Nickel And Gold Plated Microwave Packages Heat Sink Description: They are composites of molybdenum and copper. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the ... Read More
Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits (I/C) Description: With technology development, there are more need for higher power in smaller microelectronics components. This also increase ... Read More
Excellent Hermeticity Through Nickel And Gold Plating Mocu Heat Sink For Rf Amplifiers Description: With technology development, there are more need for higher power in smaller microelectronics components. This ... Read More
Molybdenum Copper Carrier With Lower Thermal Conductivity And A Wider CTE Range For GaN Devices Description: Molybdenum copper heat sink is one of the heat spreader materials. It has been frequently chosen by ... Read More
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Molybdenum Copper MoCu CuMo Heat Sinks For Electric Vehicles Description: MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and copper. It consists of both the characteristics of molybdenum ... Read More