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| Material: | Molybdenum Copper | Density: | 9.8 |
|---|---|---|---|
| CTE: | 7 | TC: | 190-200 |
| Application: | Electric Vehicles | ||
| High Light: | copper base plate,copper block heat sink |
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Molybdenum Copper MoCu CuMo Heat Sinks For Electric Vehicles
Description:
MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, being non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp. It makes MoCu suitable for volume produce.
Advantages:
High thermal conductivity since no sintering additives have been used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content no more than 75 wt%)
Semi-finished or finished (Ni/Au plated) parts available
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.
Product picture:
