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Product Details:
Payment & Shipping Terms:
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| Grade:: | Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50 | Surface:: | Low Surface Roughness |
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| Dimensions:: | Based On Customer Requirements | Plating:: | Nickel Plating And Gold Plaing |
| Shape:: | Shims Or Sheets Or Fabricated Parts | ||
| High Light: | molybdenum element,mocu |
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Excellent Hermeticity Through Nickel And Gold Plating Mocu Heat Sink For Rf Amplifiers
Description:
With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum copper material is a wise choice.
Case study:
For radar systems, our customers need custom-shaped electronics heat sink for its channels.
The dimensions of the part is about 0.2mm thickness, 4.5mm width, and 6.8mm length.
To reach a good thermal conductivity, we offer 70Mo30Cu for its application.
The molybdenum copper heat sink is nickel plated based on the specification in SAE AMS-C26074 and gold plated based on the
specification Mil-G-45204C.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper have been used in various fields like opto-electronics, high-frequency applications, power electronics and micro-electronics.
In these sectors, they are often employed in below components like:
GaN/GaAs transistors
Ceramic packages used in microwave and RF fields
Components in radio base station of telecommunication
High-power LEDs
IGBT modules for EV/HEV and stationary transformers
