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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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molybdenum plate

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China CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier factory

CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier
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CPC Heat Sink / Carrier / Submount / Flange For RF And Microwave Amplifier / Transistor / TR Moudle Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and ... Read More
2018-11-29 15:32:03
China MoCu Flange Molybdenum Copper Heat Spreader For Optoelectronics Packages factory

MoCu Flange Molybdenum Copper Heat Spreader For Optoelectronics Packages
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MoCu Flange Molybdenum Copper Heat Spreader For Optoelectronics Packages Description: It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But ... Read More
2018-12-05 13:54:41
China High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages factory

High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages
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High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and ... Read More
2019-02-26 10:20:20
China LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation factory

LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation
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LDMOS RF Transistor Cu/Mo/Cu Flanges With Good Heat Dissipation Description: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high ... Read More
2019-02-25 14:52:44
China Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity factory

Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity
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High Thermal Conductivity Mo50Cu Moly/Copper Heat Sink Material Description: Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can ... Read More
2019-07-26 11:20:56
China Cu/Mo/Cu CMC111 Heat Spreader Golden Color For RF And Microwave Amplifiers factory

Cu/Mo/Cu CMC111 Heat Spreader Golden Color For RF And Microwave Amplifiers
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Cu/Mo/Cu CMC111 heat spreader for RF and Microwave Amplifiers Description: CMC or CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core ... Read More
2018-11-29 15:39:29
China WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish factory

WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish
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WCu / MoCu / CMC / CPC Heat Sink Materials For Electronic Packaging Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has ... Read More
2018-11-29 15:39:29
China Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics factory

Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics
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Tungsten Copper Heat Sink For Hermetic Packages Electronics In Microelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal ... Read More
2018-11-29 15:32:03
China Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers factory

Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers
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Heat Dissipation Tungsten Copper Flange For Ceramic Packages In Optoelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal ... Read More
2018-11-29 15:32:03
China Cuw Base Tosa Package Hermetic Packages Electronics Butterfly Package Receivers Transmitters factory

Cuw Base Tosa Package Hermetic Packages Electronics Butterfly Package Receivers Transmitters
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W90cu10 W85cu15 Cuw Base Tosa Package Butterfly Package Receivers Transmitters Tunable Lasers Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to ... Read More
2018-11-29 15:32:03
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