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Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )

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Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

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The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

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Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )

China Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) supplier
Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) supplier Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C ) supplier

Large Image :  Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )

Product Details:

Place of Origin: China
Brand Name: JBNR
Certification: ISO9001
Model Number: HCMC021

Payment & Shipping Terms:

Minimum Order Quantity: 10 pcs
Price: Negotiable
Packaging Details: Wooden boxes
Delivery Time: 20 days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 5 tons a month
Detailed Product Description
Grade:: Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50 Surface:: Grinded
Dimensions:: Based On Customer Requirements Plating:: Nickel Plating And Gold Plaing
Shape:: Shims Or Sheets Or Fabricated Parts Name: Copper Molybdenum Alloy
High Light:

copper base plate

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copper block heat sink

 

Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits (I/C)

 

Description:

With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.

For sensitive components, to use metal composite like molybdenum copper material is a wise choice. 

Molybdenum copper is a composite with molybdenum and copper. By combining these two materials together, we can have adjustable CTE and TE. If you have any doubt about how to choose materials, you can come to us, our engineer will give you references.

 

 

 

Advantages:

 

  • High thermal conductivity since no sintering additives have been used
  • Excellent hermeticity
  • Relatively small density
  • Stampable sheets available (Mo content no more than 75 wt%)
  • Semi-finished or finished (Ni/Au plated) parts available

 

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

 

Copper Molybdenum Heat Sinks & Pedestals For Integrated Circuits ( I / C )

 

Applications:

Molybdenum copper have been used as Heat Sinks & Pedestals For Integrated Circuits (I/C).

It is also used in applications like opto-electronics, high-frequency applications, power electronics and micro-electronics.

In these sectors, they are often employed in below components like:

 

GaN/GaAs transistors

Ceramic packages used in microwave and RF fields

Components in radio base station of telecommunication

High-power LEDs

IGBT modules for EV/HEV and stationary transformers

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: admin

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