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molybdenum copper heat spreaders

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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molybdenum copper heat spreaders

(72)
China Nickel Plated Gold Plated Hermetic Packages Electronics Cu/Mo70Cu/Cu Carriers factory

Nickel Plated Gold Plated Hermetic Packages Electronics Cu/Mo70Cu/Cu Carriers
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Nickel Plated Gold Plated Good Lamination Cu/Mo70Cu/Cu Carriers In High Power Devices Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad ... Read More
2018-11-29 15:32:03
China Cuw Base Tosa Package Hermetic Packages Electronics Butterfly Package Receivers Transmitters factory

Cuw Base Tosa Package Hermetic Packages Electronics Butterfly Package Receivers Transmitters
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W90cu10 W85cu15 Cuw Base Tosa Package Butterfly Package Receivers Transmitters Tunable Lasers Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to ... Read More
2018-11-29 15:32:03
China W85Cu15 Flange Hermetic Packages Electronics For RF Packages / Opto Packages factory

W85Cu15 Flange Hermetic Packages Electronics For RF Packages / Opto Packages
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W85Cu15 Flange For Hermetic Packages/RF Packages/Opto Packages Description: Electronic packaging material are requested certain mechanical strength, good electrical properties, thermal properties and chemical ... Read More
2019-04-11 14:06:37
China Thin Thickness Copper Molybdenum Alloy Carrier Wafer For High Power Led factory

Thin Thickness Copper Molybdenum Alloy Carrier Wafer For High Power Led
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Thin Thickness Molybdenum Copper Carrier Wafer For High Power Led Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and ... Read More
2019-08-07 15:10:49
China Tailored Thermal Expansion MoCu Heat Sinks For Airborne / Satellite Radar factory

Tailored Thermal Expansion MoCu Heat Sinks For Airborne / Satellite Radar
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Tailored Thermal Expansion Critical Dimensional Tolerance MoCu Heat Sinks For Airborne/Satellite Radar Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ... Read More
2018-11-29 15:39:29
China Fine Particle Size Thermal Uniform MoCu Heat Sinks For RF And Microwave GAAS Circuits factory

Fine Particle Size Thermal Uniform MoCu Heat Sinks For RF And Microwave GAAS Circuits
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Fine Particle Size Thermal Uniform MoCu Heat Sinks For RF And Microwave (GAAS) Circuits Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal ... Read More
2018-11-29 18:04:00
China Mo80Cu20 Pads Mo75C25 Carriers Copper Molybdenum Alloy For High Power Amplifiers factory

Mo80Cu20 Pads Mo75C25 Carriers Copper Molybdenum Alloy For High Power Amplifiers
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Mo80Cu20 Pads Mo75C25 Carriers Copper Molybdenum Alloy For High Power Amplifiers Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion ... Read More
2019-02-28 16:36:04
China Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging factory

Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging
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Excellent X-Y Expansion Cross-rolled Moly Copper Sheet For Supporting Cases For I/C Packaging Description: With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Sheet (MoCu) ... Read More
2019-08-07 15:11:40
China Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors factory

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
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Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors Description: Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher ... Read More
2019-05-15 14:07:02
China High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material factory

High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
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Heat Sink Molybdenum Copper Electronic Packing Material Description: MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But ... Read More
2019-09-17 17:03:31
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