Thank you for providing me with the satisfied products and very thoughtful service! We will order again!
—— Roy Hilliard
The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!
—— David Balazic
We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.
Excellent CTE High TC No Voids Of CPC Heat Spreader For Hermetic Packages Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ... Read More
CPC Heat Spreader For Hermetic Packages Electronics RF GaN HEMT Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the ... Read More
Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials Description: Copper Tungsten are composites of tungsten and copper. By adjusting the content of ... Read More
Mo70Cu Heatspreader Materials For Automobile And Industrial Machinery Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity ... Read More
Strong Interface Bonding Resist 850C Heat Shock Repeatedly Cu/MoCu/Cu Heat Sinks For LDMOS Devices Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two ... Read More
High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and ... Read More
Heat Dissipation Tungsten Copper Flange For Ceramic Packages In Optoelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal ... Read More
Tungsten Copper Heat Sink For Hermetic Packages Electronics In Microelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal ... Read More
Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also ... Read More
Tungsten Copper Flange / Base For RF Package / Hermetic Package Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper ... Read More
