Product Details:
Payment & Shipping Terms:
|
| Material: | Molybdenum Copper | Density: | 9.5 |
|---|---|---|---|
| CTE: | 10.2 | TC: | 220-250 |
| Plating: | Nickel And Gold | Name: | Electronic Packaging Materials |
| High Light: | copper base plate,copper block heat sink |
||
Heat Sink Molybdenum Copper Electronic Packing Material
Description:
MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.
Advantages:
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products availabl
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.
Product picture:
