Product Details:
Payment & Shipping Terms:
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| Material: | Tungsten Copper | Density: | 16.4 |
|---|---|---|---|
| CTE: | 7.2 | TC: | 180-190 |
| Brand: | JBNR | Application: | Hermetic Packages/RF Packages/Opto Packages |
| High Light: | tungsten copper heat spreader,copper molybdenum heat base |
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W85Cu15 Flange For Hermetic Packages/RF Packages/Opto Packages
Description:
Electronic packaging material are requested certain mechanical strength, good electrical properties, thermal properties and chemical stability. According to the different type of integrated circuit and practical place, we choose different packaging structure and materials.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
These composite are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc..
Product picture:
