Product Details:
Payment & Shipping Terms:
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Material: | Copper/moly Copper/copper | Density: | 9.2 |
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CTE: | 9.5 | TC: | 260 |
Application: | Power Device Package | Plating: | Nickel And Gold |
High Light: | molybdenum element,mocu heat sink |
High Thermal Expansion Molybdenum Copper Cu/MoCu/Cu(CPC) sheet
Description:
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 |
280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.
Product picture: