Product Details:
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| Grade:: | Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50 | Surface:: | Low Surface Roughness |
|---|---|---|---|
| Dimensions:: | Based On Customer Requirements | Plating:: | Nickel Plating And Gold Plaing |
| Shape:: | Shims Or Sheets Or Fabricated Parts | ||
| High Light: | molybdenum element,mocu heat sink |
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Accurate Tolerance Ag Plate High Thermal Conductivity 70MoCu For IGBT In EV / HEV Industry
Description:
With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum copper material is a wise choice.
Advantages:
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Applications:
Molybdenum copper have been used in various fields like opto-electronics, high-frequency applications, power electronics and micro-electronics.
In these sectors, they are often employed in below components like:
GaN/GaAs transistors
Ceramic packages used in microwave and RF fields
Components in radio base station of telecommunication
High-power LEDs
IGBT modules for EV/HEV and stationary transformers
