Product Details:
Payment & Shipping Terms:
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| Grade:: | Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50 | Surface:: | Low Surface Roughness |
|---|---|---|---|
| Dimensions:: | Based On Customer Requirements | Plating:: | Nickel Plating And Gold Plaing |
| Shape:: | Shims Or Sheets Or Fabricated Parts | Properties:: | Tailored Thermal Conductivity And Thermal Expansions |
| High Light: | molybdenum element,mocu heat sink |
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Cu-Mo Base Plate For Power Module In Automobile And Industrial Machinery
Description:
Molybdenum copper heat sink is one of the heat spreader materials.
It has been frequently chosen by engineers for its cost and quality ratio. It has good thermal conductivity and wide thermal expansion.
Compared with other materials, it has good machineability.
We can offer 85MoCu to 50MoCu sheets, machined parts, or stamped parts, wire cutting parts.
And based on different application, we can offer plating based on your requirements. After plating, we will ensure your have a good welding condition.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.01 | 7 | 200(25℃)/156(100℃) |
| 80MoCu | 80±2% | 9.9 | 7 | 170(25℃)/190(100℃) |
| 70MoCu | 70±2% | 9.8 | 7.3 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 8.4 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
