Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device
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Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device
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Product Details:
| Place of Origin: |
CHINA |
| Brand Name: |
JBNR |
| Model Number: |
CPC141,CPC232,CPC300 |
Payment & Shipping Terms:
| Minimum Order Quantity: |
Negotiation |
| Price: |
Negotiable |
| Packaging Details: |
as customer required |
| Delivery Time: |
15days |
| Payment Terms: |
L/C, , T/T, Western Union |
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Detailed Product Description
| Material: |
Copper/moly Copper/copper |
Density: |
9.2 |
| CTE: |
9.5 |
TC: |
260 |
| Application: |
RF Power Device Package |
| High Light: |
copper base plate, copper block heat sink |
Cu / Mo70Cu / Cu (CPC) Heat Sinks and Shims For High Power Device
Description:
Cu/Mo70Cu/Cu is a sandwich composite similar to that of Cu/Mo/Cu with a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1: 4: 1. It has different CTE in X and Y direction, with higher thermal conductivity than that of W(Mo)Cu &Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism
Product Properties:
| Grade |
Density g/cm3 |
Coefficient of thermal
Expansion ×10-6 (20℃)
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Coefficient of thermal
Expansion ×10-6 (20℃)
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| CPC141 |
9.5 |
7.3 |
280(XY)/170(Z)
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| CPC232 |
9.3 |
10.2 |
255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.
Product picture:
