Product Details:
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| Material: | Tungsten Copper | Density: | 12.2 |
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| CTE: | 12.5 | TC: | 310-340 |
| Plating: | Gold | Application: | Electronic Packaging |
| High Light: | copper base plate,copper block heat sink |
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WCu Flanges / Heat Sinks W90Cu10 W80Cu20 W50Cu50 Substrates With excellent TC
Description:
W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivityproperties, and the tungsten and copper in the thermal expansion coefficient andthermal conductivity can be adjusted with the W-Cu composition, also the compositecan be machined to various shape, these features make the application of thiscomposite with great convenience. The thermal expansion can be adjusted to matchwith the following materials:
(1) Ceramic materials: Al203(A-90, A-95, A-99), BeO(B-95, B-99), AIN, etc
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs
(3)Metal Material: Kovar alloy (4J29), 42 alloy;
Advantages:
No Fe, Co, Ni, Mn and other elements addeled as the sintering activator, to maintain a high thermal conductivity.
Excellent hermeticity
Can provide semi-finished or finished (Ni/Au plated)products
Precision machining and excellent dimensional control, surface finish and flatness
With close technical supports including product design, custom manufacturing testing and post sale supports
Product Properties:
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Application:
This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
Product picture:
