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| Material: | Molybdenum Copper | Density: | 9.9 |
|---|---|---|---|
| CTE: | 7 | TC: | 170-190 |
| High Light: | copper base plate,copper block heat sink |
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0.05T Mo80Cu20 Moly / Copper Heat Sink Material For Radio Frequency Industry
Description:
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Advantages:
Good machinability
Good hermeticity
Good thermal conductivity
Good mechanical strength to provide excellent mechanical protection to the IC
Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
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