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Cu - W Semiconductor Substrate

CPC Heat Spreaders

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Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations

Large Image : Cu / Mo70Cu / Cu Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations

Product Details:

Place of Origin:	CHINA
Brand Name:	JBNR
Model Number:	CPC141,CPC232,CPC300

Payment & Shipping Terms:

Minimum Order Quantity:	Negotiation
Price:	Negotiable
Packaging Details:	as customer required
Delivery Time:	15days
Payment Terms:	L/C, , T/T, Western Union

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Detailed Product Description

Material:	Copper/moly Copper/copper	Density:	9.5
CTE:	7.3	TC:	170
Application:	RF Power Device Package
High Light:	copper base plate , copper block heat sink

CPC (Cu/Mo70Cu/Cu) Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations

Description:

CPC is a composite material with a laminated structure with Cu layers above and below the Cu-Mo composite material. Thermal conductivity and linear expansion coefficient can be changed by combining the composition of the core material Cu-Mo and the lamination ratio. In addition, because both surfaces are Cu, the initial heat radiation effect is excellent.
It is mainly used for wireless communications, especially amplifier substrates of mobile phone base stations.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)