Product Details:
Payment & Shipping Terms:
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| Grade:: | Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50 | Surface:: | Low Surface Roughness |
|---|---|---|---|
| Dimensions:: | Based On Customer Requirements | Plating:: | Nickel Plating And Gold Plaing |
| Shape:: | Stamped Parts, Machined Parts Or Blank Sheet | ||
| High Light: | molybdenum element,mocu |
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Strict Dimension Control 80Mo20Cu With Nickel And Gold Plated For Radar System In Telecommunication
Description:
With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum copper material is a wise choice.
Case study:
If you are designer, we can give you recommendation of what material will be suitable for you.
If you are trader, we can know what you are have missed and give more information you need.
If you are doing machining and plating, we will give you the right material and you can directly use it and have no worries of the following steps.
We offer carriers, tabs or spacers for modules. Based on different structure design, the production process will also differ from each other.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper have been used in various fields like opto-electronics, high-frequency applications, power electronics and micro-electronics.
In these sectors, they are often employed in below components like:
GaN/GaAs transistors
Ceramic packages used in microwave and RF fields
Components in radio base station of telecommunication
High-power LEDs
IGBT modules for EV/HEV and stationary transformers
