Product Details:
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Material: | Copper/moly Copper/copper | Density: | 9.5 |
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CTE: | 7.3 | TC: | 220 |
Application: | LDMOS | ||
High Light: | copper base plate,copper block heat sink |
Nickel And Gold Plated CPC Heat Spreader Material For LDMOSs With Low CTE And High TC
Description:
Grade | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 |
280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
It is widely used as Microwave carriers and heat sinks,BGA Packages,LED packages,GaAs device mount,high-frequency packages designed for wireless applications,cellular base stations,LDMOSs etc.
Product picture: