Product Details:
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| Material: | Tungsten Copper | Density: | 14.9 |
|---|---|---|---|
| CTE: | 9.0 | TC: | 220-230 |
| Application: | Ceramic Packages | ||
| High Light: | copper base plate,copper block heat sink |
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Cu-W Heat Spreader Material for Ceramic Packages CuW Electronic thermal management materials
Description:
Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today.With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.
It is an composite of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Advantages:
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products available
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.
Product picture:
