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| Material: | Molybdenum Copper | Density: | 9.54 |
|---|---|---|---|
| CTE: | 11.5 | TC: | 230-270 |
| Application: | GaAs/ GaN Amplifier | ||
| High Light: | copper base plate,copper block heat sink |
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Nickel And Gold Plated Molybdenum Copper MoCu Flange GaAs / GaN Amplifier Flanges
Description:
Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Advantages:
1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
Product Properties:
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Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
Product picture:
