Product Details:
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| Material: | Tungsten Copper | Density: | 17.0 |
|---|---|---|---|
| CTE: | 6.5 | TC: | 180-190 |
| Brand: | JBNR | Application: | Laser Diode Submounts |
| High Light: | copper base plate,copper block heat sink |
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CuW Sub - Mounts CuW10/90 Heat Sink Tungsten Copper Laser Diode Packaging
Description:
They are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
These composite are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc..
Product picture:
