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CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

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CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

Large Image : CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

Product Details:

Place of Origin:	CHINA
Brand Name:	JBNR
Model Number:	CPC141,CPC232,CPC300

Payment & Shipping Terms:

Minimum Order Quantity:	Negotiation
Price:	Negotiable
Packaging Details:	as customer required
Delivery Time:	15days
Payment Terms:	L/C, , T/T, Western Union

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Detailed Product Description

Material:	Copper/moly Copper/copper	Density:	9.5
CTE:	7.6	TC:	200
Application:	Power Device Packages
High Light:	copper heat sink , copper base plate

CPC141 Carrier / Base / Heat Sink For Powder Device Packages

Description:

Has the same thermal expansion coefficient as that of alumina ceramic, widely used for ceramic package using alumina. As the surface is copper with high thermal conductivity, it has excellent heat diffusion.

Advantages:

1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)

CPC232