Product Details:
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| Material: | Molybdenum Copper | Density: | 9.66 |
|---|---|---|---|
| CTE: | 7.5 | TC: | 220 |
| Application: | IC Packages | ||
| High Light: | copper base plate,copper block heat sink |
||
IC Substrate Molybdenum Copper Heat Sink / 80MoCu Heat Sink For IC Packages
Description:
It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.
Advantages:
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products available
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Product picture:
