Product Details:
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| Material: | Tungsten Copper | Density: | 17 |
|---|---|---|---|
| CTE: | 6.5 | TC: | 176 |
| Application: | Electronic Packaging | ||
| High Light: | copper heat sink,copper block heat sink |
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90WCu / Tungsten Copper 90 / 10 Heat Sink For Electronic Packaging
Description:
Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chips, thin film integrated circuit substrate, hybrid integrated circuit chips) placed in a corresponding shell container, which can provide a stable environment to protect chips work normally and keep stable functions in integrated circuit. At the same time, encapsulation also is connection method of outputting and inputting to make the transition to outside, and it can form a completed entirety with chips.
W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void
Product Properties:
| Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.
Product picture:
