Product Details:
Payment & Shipping Terms:
|
| Material: | Molybdenum Copper | Density: | 9.5 |
|---|---|---|---|
| CTE: | 11.5 | TC: | 230-270 |
| High Light: | tungsten copper heat spreader,copper molybdenum heat base |
||
High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages
Description:
Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Advantages:
High thermal conductivity since no sintering additives have been used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content no more than 75 wt%)
Semi-finished or finished (Ni/Au plated) parts available
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
Product picture:
