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copper heat sink

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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copper heat sink

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China Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging factory

Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging
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Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging Description: W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion ... Read More
2018-11-29 15:32:03
China CPC141 Carrier Heat Spreader Hermetic Packages Electronics No Magnetism factory

CPC141 Carrier Heat Spreader Hermetic Packages Electronics No Magnetism
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CPC141 Carrier / Heat Spreader / Flange For Hermetic Packages And Microelectronic Packages Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two ... Read More
2018-11-29 15:32:03
China Excellent Flatness Tungsten Copper Flange / Base For RF Package / Hermetic Package factory

Excellent Flatness Tungsten Copper Flange / Base For RF Package / Hermetic Package
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Tungsten Copper Flange / Base For RF Package / Hermetic Package Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper ... Read More
2018-11-29 15:32:03
China High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages factory

High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages
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High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and ... Read More
2019-02-26 10:20:20
China Thin Thickness Copper Molybdenum Alloy Carrier Wafer For High Power Led factory

Thin Thickness Copper Molybdenum Alloy Carrier Wafer For High Power Led
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Thin Thickness Molybdenum Copper Carrier Wafer For High Power Led Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and ... Read More
2019-08-07 15:10:49
China Tungsten Copper Base Circuit Board factory

Tungsten Copper Base Circuit Board
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Tungsten Copper Base Circuit Board Hermetic Packages Electronics For Metal Package Good Thermal Conductivity Tungsten Copper Base Circuit Board For Metal Package Description: Tungsten Copper is a composite of ... Read More
2019-07-01 14:21:23
China Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging factory

Excellent X - Y Expansion Cross Rolled Moly Copper Sheet For Supporting Cases / I / C Packaging
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Excellent X-Y Expansion Cross-rolled Moly Copper Sheet For Supporting Cases For I/C Packaging Description: With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Sheet (MoCu) ... Read More
2019-08-07 15:11:40
China Mo80Cu20 Pads Mo75C25 Carriers Copper Molybdenum Alloy For High Power Amplifiers factory

Mo80Cu20 Pads Mo75C25 Carriers Copper Molybdenum Alloy For High Power Amplifiers
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Mo80Cu20 Pads Mo75C25 Carriers Copper Molybdenum Alloy For High Power Amplifiers Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion ... Read More
2019-02-28 16:36:04
China Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors factory

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
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Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors Description: Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher ... Read More
2019-05-15 14:07:02
China High Erosion Resistance Tungsten Copper Bar High Purity Tungsten Material factory

High Erosion Resistance Tungsten Copper Bar High Purity Tungsten Material
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High Erosion Resistance Tungsten Copper Block, Plate, Rod, Cube For EDM Or EGM Description: By selecting high purity tungsten and oxygen-free copper, all of our tungsten copper alloys are produced by sintering ... Read More
2019-08-14 11:31:05
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