Product Details:
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| Material: | Molybdenum Copper | Density: | 9.7 |
|---|---|---|---|
| CTE: | 10.3 | TC: | 210-250 |
| High Light: | copper base plate,copper block heat sink |
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Moly Copper Thermal Management Carrier Plates For IGBT modules
Description:
These composite materials have copper content that can be modified to adapt the base plate’s thermal properties to the entire assembly. Since molybdenum-copper composites are lightweight, they are ideal for those applications where every gram is important. In the automotive industry, for instance, the composites are utilized as carrier plates in the IGBT modules. These modules function as inverters in electric drives.
Advantages:
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than 75wt.%)
Semi-finished or finished (Ni/Au plated) parts available
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
These composite are widely used in applications such as IGBT modules.Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Product picture:
