Thank you for providing me with the satisfied products and very thoughtful service! We will order again!
—— Roy Hilliard
The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!
—— David Balazic
We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.
LDMOS RF Transistor Cu/Mo/Cu Flanges With Good Heat Dissipation Description: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high ... Read More
High Thermal Expansion Molybdenum Copper Flanges For RF and Microwave Packages In Microelectronics Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ... Read More
Excellent Thermal Expansion Coefficient Of Molybdenmum Copper Base Plate For LDMOS Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion ... Read More
MoCu15 Microelectronic Thermal Spreaders And Thermal Management Base Plate Description: Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum ... Read More
Excellent CTE Light Weight Molybdenum Copper Spacer For IGBT Devices Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and ... Read More
Strong Interface Bonding Resist 850C Heat Shock Repeatedly Cu/Mo/Cu Heat Sinks For LDMOS Devices Description: Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite ... Read More
Heat Dissipation Tungsten Copper Flange For Ceramic Packages In Optoelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal ... Read More
Strong Interface Bonding Resist 850C Heat Shock Repeatedly Cu/MoCu/Cu Heat Sinks For LDMOS Devices Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two ... Read More
Mo70Cu Heatspreader Materials For Automobile And Industrial Machinery Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity ... Read More
MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ... Read More