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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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mocu heat sink

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China Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity factory

Mo50Cu Moly / Copper Heat Sink Material With High Thermal Conductivity
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High Thermal Conductivity Mo50Cu Moly/Copper Heat Sink Material Description: Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can ... Read More
2019-07-26 11:20:56
China Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials factory

Copper Molybdenum Cu - Mo Heat Sink Copper Base Plate Composite Materials
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Copper Molybdenum (Cu-Mo) Heat Sink Composite Materials Description: MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But ... Read More
2019-09-17 16:45:55
China Light Weight Molybdenum Copper Heat Transfer For Sensitive Electronic Components factory

Light Weight Molybdenum Copper Heat Transfer For Sensitive Electronic Components
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Light Weight And Tailored Thermal Conductivity Molybdenum Copper Heat Transfer For Sensitive Electronic Components Description: With technology development, there are more need for higher power in smaller ... Read More
2019-05-15 14:07:02
China Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors factory

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
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Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors Description: Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher ... Read More
2019-05-15 14:07:02
China High Thermal Expansion Molybdenum Copper Flanges , Unplated Mocu Heat Sink factory

High Thermal Expansion Molybdenum Copper Flanges , Unplated Mocu Heat Sink
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High Thermal Expansion Molybdenum Copper Flanges For RF and Microwave Packages In Microelectronics Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ... Read More
2018-11-29 15:32:03
China Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices factory

Strong Interface Bonding Hermetic Packages Electronics Cu/MoCu/Cu Heat Sinks For LDMOS Devices
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Strong Interface Bonding Resist 850C Heat Shock Repeatedly Cu/MoCu/Cu Heat Sinks For LDMOS Devices Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two ... Read More
2018-11-29 15:32:03
China High Thermal Expansion Cu / Mo / Cu Heat Spreader , CMC Alloy Copper Heat Sink factory

High Thermal Expansion Cu / Mo / Cu Heat Spreader , CMC Alloy Copper Heat Sink
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High Thermal Expansion Molybdenum Copper Molybdenum Flanges For RF and Microwave Packages In Microelectronics Description: Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat... Read More
2019-01-21 15:40:30
China Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink factory

Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink
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Hermetic Packages Electronics Material Cu/MoCu/Cu High-Performance Heat Sink Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ... Read More
2018-11-29 15:32:03
China Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip factory

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
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Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip Description: With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material ... Read More
2019-08-07 15:20:16
China MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION factory

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION
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MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION Description: Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable ... Read More
2018-11-29 15:32:03
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