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| Material: | 80% Tungsten ,20% Copper | Sized: | Customized |
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| Density: | 15.15 G/cm3 | Hardness: | 220HB Kgf/mm2≥ |
| Resistivity: | 5.0 µΩ.cm≤ | IACS: | 34%≥ |
| Bending Strength: | 980 Mpa≥ | Application: | Electrodes For Spark Erosion |
| High Light: | copper tungsten electrodes,copper tungsten |
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Tungsten Copper alloy Electrical contact W80Cu20
Tungsten copper alloys are used where the combination of high heat resistance, high electrical and/or thermal conductivity, and low thermal expansion are needed. Some of the applications are in electric resistance welding, as electrical contacts, and as heat sinks. As contact material the alloy is resistant to erosion by electric arc. WCualloys are also used in electrodes for electrical discharge machining and electrochemical machining.
Advantages
Higer thermal conductivity
Low thermal expansion
High arc resistance combined with good electrical conductivity
Applications
.1.Resistance Welding
The high physical and mechanical properties, as well as the thermal and electrical conductivity, of refractory metal composites make tungsten copper alloy very suitable for die inserts and electrode facings, flash and butt welding dies, and hot upsetting. They can also solve heat balance problems.
2.Electrical Contacts
Electrical contacts are subjected to extreme mechanical and thermal stresses during operation. For fractions of a second, temperatures rise to several thousand degrees as a result of the arcing. Our tungsten copper materials are used owing to their unique physical properties.
3.EDM and ECM
Tungsten copper alloys are used worldwide for EDM (Electrical Discharge Machining) and ECM (Electrochemical Machining) electrodes. All material is manufactured by the press, sinter, and infiltrate process. Virgin tungsten powders are used, resulting in a consistent homogeneous material giving high and even burning rates. Tungsten copper is used in plunger/sinker applications where intricate definition is required, especially in tungsten carbide.
Tungsten Copper alloyTechnical Data
| Grade No | Chemical | Composition % | Density | Hardness | Resistivity | IACS | Bending Strength | |
| Cu | Impurity | Wolfram | g/cm3≥ | HB Kgf/mm2≥ | µΩ.cm≤ | %≥ | Mpa≥ | |
| W50/Cu50 | 50±2.0 | 0.5 | Balance | 11.85 | 115 | 3.2 | 54 | |
| W55/Cu45 | 45±2.0 | 0.5 | Balance | 12.3 | 125 | 3.5 | 49 | |
| W60/Cu40 | 40±2.0 | 0.5 | Balance | 12.75 | 140 | 3.7 | 47 | |
| W65/Cu35 | 35±2.0 | 0.5 | Balance | 13.3 | 155 | 3.9 | 44 | |
| W70/Cu30 | 30±2.0 | 0.5 | Balance | 13.8 | 175 | 4.1 | 42 | 790 |
| W75/Cu25 | 25±2.0 | 0.5 | Balance | 14.5 | 195 | 4.5 | 38 | 885 |
| W80/Cu20 | 20±2.0 | 0.5 | Balance | 15.15 | 220 | 5.0 | 34 | 980 |
| W85/Cu15 | 15±2.0 | 0.5 | Balance | 15.9 | 240 | 5.7 | 30 | 1080 |
| W90/Cu10 | 10±2.0 | 0.5 | Balance | 16.75 | 260 | 6.5 | 27 | 1160 |
