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Material: | Molybdenum Copper | Density: | 9.8 |
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CTE: | 7 | TC: | 190-200 |
High Light: | copper base plate,copper block heat sink |
Molybdenum Copper Heat Sink Nickel And Gold Plated Microwave Packages Heat Sink
Description:
They are composites of molybdenum and copper. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the content of molybdenum. Mo-Cu is much lighter than W-Cu so that it is suitable for aeronautic and astronautic applications.
Advantages:
High thermal conductivity since no sintering additives have been used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content no more than 75 wt%)
Semi-finished or finished (Ni/Au plated) parts available
Product Properties:
Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Our products are widely used in applications such as electronics packages, Microwave Packages, IC Packages,IPC base plate, Laser Submounts etc.
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