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High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet

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Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

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High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet

Large Image : High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet

Product Details:

Place of Origin:	CHINA
Brand Name:	JBNR
Model Number:	CPC141,CPC232,CPC300

Payment & Shipping Terms:

Minimum Order Quantity:	Negotiation
Price:	Negotiable
Packaging Details:	as customer required
Delivery Time:	15days
Payment Terms:	L/C, , T/T, Western Union

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Detailed Product Description

Material:	Copper/moly Copper/copper	Density:	9.2
CTE:	9.5	TC:	260
Application:	Power Device Package	Plating:	Nickel And Gold
High Light:	molybdenum element , mocu heat sink

High Thermal Expansion Molybdenum Copper Cu/MoCu/Cu(CPC) sheet

Description:

CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core layer and two copper clad layers . They have different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)