Product Details:
Payment & Shipping Terms:
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| Grade:: | Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50 | Surface:: | Low Surface Roughness |
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| Dimensions:: | Based On Customer Requirements | Plating:: | Nickel Plating And Gold Plaing |
| Shape:: | Shims Or Sheets Or Fabricated Parts | ||
| High Light: | molybdenum element,mocu heat sink |
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Light Weight And Tailored Thermal Conductivity Molybdenum Copper Heat Transfer For Sensitive Electronic Components
Description:
With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.
For sensitive components, to use metal composite like molybdenum copper material is a wise choice.
What we can:
For moly copper, we offer sheet or plate to customers. Customers will use it to fabricate different parts.
To reach a good plating and welding effect, we will offer good surface for the application.
If customers directly use it in high power amplifiers, we can offer plated parts based on the drawings.
The grade we can offer: 85MoCu, 80MoCu, 70MoCu, 60MoCu, 50MoCu.
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat sinks are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.
