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Mo70Cu Heatspreader Materials For Automobile And Industrial Machinery
Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.
|Grade||Mo Content||Density g/cm3||
Coefficient of thermal
Expansion ×10-6 (20℃)
|Thermal conductivity W/(M·K)|
Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.