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LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

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Good quality Heat Sink for sales
Good quality Heat Sink for sales
Thank you for providing me with the satisfied products and very thoughtful service! We will order again!

—— Roy Hilliard

The MoCu pads have been tested and already mounted to the components. Just wanted to let you know they are quite impressive. Completely meet our quality standards!

—— David Balazic

We have been using Jiabang's CPC1:4:1 as base flanges for about 2 years. Their products always maintain a high stability for our products. We can deliver their materials to customers with confidence. We consider zhuzhou jiabang is a trustworthy business partner.

—— Merinda Collins

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LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

China LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation supplier

Large Image :  LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

Product Details:

Place of Origin: CHINA
Brand Name: JBNR
Model Number: CMC111,CMC121,CMC131,CMC141,CMC13/74/13

Payment & Shipping Terms:

Packaging Details: as customer required
Delivery Time: 15days
Payment Terms: L/C, , T/T, Western Union
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Detailed Product Description
Material: Copper/moly/copper Density: 9.75
CTE: 6.0 TC: 180-220

 

LDMOS RF Transistor Cu/Mo/Cu Flanges With Good Heat Dissipation
 
Description:

 

Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
 
Advantages:
 
1.Can be stamped into components
2.Strong interface bonding resist to 850℃ heat shock repeatedly
3.High thermal conductivity
 
Product Properties:

 

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
CMC111 9.32 8.8 305(XY)/250(Z)
CMC121 9.54 7.8 260(XY)/210(Z)
CMC131 9.66 6.8 244(XY)/190(Z)
CMC141 9.75 6 220(XY)/180(Z)
CMC13/74/13 9.88 5.6 200(XY)/170(Z)

 

Application:
 

Cu/Mo/Cu(CMC) carrier has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

 

Product picture:

LDMOS RF Transistor Hermetic Packaging Cu / Mo / Cu Flanges With Good Heat Dissipation

Contact Details
Zhuzhou Jiabang Refractory Metal Co., Ltd

Contact Person: erin

Tel: +8613873213272

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